Best pcb assembly manufacturer? What we provide is not only PCB & MCPCB manufacturing, but also including PCB duplicating, Engineering & process design, components management & sourcing solution, PCB in house assembly & full system integration, surface mounted technology (SMT), full products assembly & testing. Find more information on best pcb assembly service. Art-of-state Technology: Most of our engineer and operators has more than ten years of experience in PCB industry, so we can produce special such as 20 OZ heavy copper board, 4 layer MCPCB, etc.
Best Through Hole Technology assemble more than 50 kinds components Factory Price. We offer a complete range of through hole PCB assembly capabilities in compliance with IPC quality standards. We provide Through Hole Technology (THT) PCBA service at the highest quality level and in a cost-effective manner. Our through hole technology (THT) PCB Assembly services includes both manual and automated techniques. While our manual soldering techniques can handle complex assemblies, the automated ones are best suited for high volume production as well as reduced material handling. We provide THT PCBA service at the highest quality level and in a cost-effective manner.
In order to provide one-stop-services to customers, we can also provide FPC and Rigid-flex PCB Assembly service (also named SMT: Surface Mounting Technology). We can purchase all components from abroad or domestic market, and provide full products to you with short lead time. High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance.
According to different manufacturing method, current there’re three basic types for ceramic board: A) Thick Film Ceramic Board Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB. B) DCB Ceramic Board DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. Find even more information at https://www.bstpcb.com/.
Advantage of MCPCB: Some LEDs dissipate between 2-5W of heat and failures occur when the heat from a LED is not properly removed; a LED’s light output is reduced as well as degradation when the heat remains stagnant in the LED package. The purpose of a MCPCB is to efficiently remove the heat from all topical IC’s (not just LEDs). The aluminum base and thermally conductive dielectric layer act as bridges between the IC’s and heat sink. One single heat sink is mounted directly to the aluminum base eliminating the need for multiple heat sinks on top of the surface mounted components.
